Idizayini yomkhiqizo emisha ihlinzeka ngezici ezihlukile ezihlangabezana nokulindelwe opharetha ku-broadband enkulu yamanje noma ukuthunyelwa kwe-NGN ngamasevisi eprimiyamu nezindleko zokufaka eziphansi.
UmzimbaOkubalulekile | I-Thermoplastic | Okubalulekile Oxhumana naye | Ithusi, ithini (Sn) Plating |
I-insulationUkumelana | > 1x10^10 Ω | Oxhumana naye Ukumelana | < 10 mΩ |
I-DielectricAmandla | 3000 V rms, 60 Hz AC | Amandla kagesi aphezulu Surge | 3000 V DC ukuhlinzwa |
UkufakwaUkulahlekelwa | <0.01 dB ukuya ku-2.2 MHz<0.02 dB ukuya ku-12 MHz<0.04 dB ukuya ku-30 MHz | BuyelaUkulahlekelwa | > 57 dB ukuya ku-2.2 MHz> 52 dB kuya ku-12 MHz> 43 dB kuya ku-30 MHz |
I-Crosstalk | > 66 dB ukuya ku-2.2 MHz> 51 dB kuya ku-12 MHz> 44 dB kuya ku-30 MHz | IsebenzaIzinga lokushisaIbanga | -10 °C kuya ku-60 °C |
ukufutheka TemperatureIbanga | -40 °C kuya ku-90 °C | UkuvuthaIsilinganiso | UL 94 V -0 ukusetshenziswa kwezinto |
I-wire RangeOxhumana nabo be-DC | 0.4 mm kuya ku-0.8 mm26 AWG kuya ku-20 AWG | Ubukhulu(Amachweba angama-48) | 135*133*143 (mm) |
Ibhulokhi ye-BRCP-SP yenza ukuxhumana kube lula nokusetshenziswa kwemishini ye-broadband (i-DSLAM, i-MSAP/N ne-BBDLC) emahhovisi amaphakathi nasezindaweni ezikude, isekela i-xDSL yefa, i-DSL enqunu, ukwabelana ngomugqa noma ukuhlukaniswa komugqa/ukuhlukanisa ngokugcwele izinhlelo zokusebenza.